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Look Inside Rapid Thermal and Integrated Processing VII

Rapid Thermal and Integrated Processing VII

Volume 525

Out of Print

Part of MRS Proceedings

  • Reprinted: June 2014
  • Date Originally Published: September 1998
  • availability: Unavailable - out of print
  • format: Paperback
  • isbn: 9781107413672

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  • The MRS proceedings series on rapid thermal processing (RTP) has become the predominant international forum for research in this exciting and fast-growing field. In particular, thisvolume in the series presents work in traditional RTP processes such as dielectric growth, annealing and silicides, as well as developments in novel modelling and integrated processes. Papers on equipment issues illustrate that problems such as temperature uniformity and measurement, traditionally viewed as limitations for RTP technology, are well on the way to being resolved. Manufacturing aspects of RTP and the successful integration of RTP into production semiconductor fabs are also addressed. Topics include: RTP equipment - modelling and new concepts; temperature measurement and control in RTP equipment; MOSFET gate stack engineering; MOSFET channel and source/drain engineering; silicides; and new applications of rapid thermal processing.

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    Product details

    • Reprinted: June 2014
    • Date Originally Published: September 1998
    • format: Paperback
    • isbn: 9781107413672
    • length: 422 pages
    • dimensions: 229 x 152 x 21 mm
    • weight: 0.56kg
    • availability: Unavailable - out of print
  • Editors

    Mehmet C. Öztürk, North Carolina State University

    Fred Roozeboom, Philips Research Laboratories, The Netherlands

    Paul J. Timans, AG Associates, San Jose, California

    Sylvia H. Pas, Texas Instruments, Dallas, Texas

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