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Look Inside Thin Films

Thin Films
Stresses and Mechanical Properties XI

Volume 875

Part of MRS Proceedings

  • Reprinted: June 2014
  • Date Originally Published: October 2005
  • availability: Unavailable - out of print
  • format: Paperback
  • isbn: 9781107408937

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About the Authors
  • This book has a long tradition of representing current topics in thin-film properties and how they are related to the performance and reliability of thin-film structures. Several emerging and well-developed technologies rely on understanding the behavior of these structures. This book provides a forum for an exchange of ideas among researchers who are interested in the mechanical behavior of thin films, broadly applied to their materials choice or methodology. The book focuses on stress-related phenomena in thin films for a wide range of materials. Of particular interest are studies that explore the frontiers of thin-film materials science with regard to materials selection or size scale. Topics include: elasticity in thin films; characterizing thin films by nanoindentation; mechanical behavior of nanostructured films; mechanical properties of thin; thin-film plasticity; thin-film plasticity; thin-film plasticity; novel testing techniques; in situ characterization techniques; adhesion and fracture of thin films; fatigue and stress in interconnect and metallization; deformation, growth and microstructure in thin films and thin-film processing.

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    Product details

    • Reprinted: June 2014
    • Date Originally Published: October 2005
    • format: Paperback
    • isbn: 9781107408937
    • length: 472 pages
    • dimensions: 229 x 152 x 24 mm
    • weight: 0.63kg
    • availability: Unavailable - out of print
  • Editors

    Thomas E. Buchheit, Sandia National Laboratories, New Mexico

    Andrew M. Minor, Lawrence Berkeley National Laboratory, California

    Ralph Spolenak, ETH Zentrum, Switzerland

    Kazuki Takashima, Kumamoto University, Japan

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