Advanced Metallization Conference 2002 (AMC 2002)
Volume 18
Part of MRS Conference Proceedings
- Editors:
- Bradley M. Melnick, Motorola, Inc., Austin
- Timothy S. Cale, Rensselaer Polytechnic Institute, New York
- Shigeaki Zaima, Nagoya University, Japan
- Tomohiro Ohta, Tokyo Electron Ltd., Tokyo
- Date Published: January 2003
- availability: Temporarily unavailable - available from TBC
- format: Hardback
- isbn: 9781558997196
Hardback
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Leading-edge metallization schemes inherently involve the introduction of novel metal systems and novel dielectric materials. Technological advances highlighted during AMC 2002 include the latest developments in integrating copper-based metallization with low-dielectric constant materials and in evaluating the reliability of such interconnects. For the second consecutive year, the volume takes a special look at the status of vertical integration, or 3D chips, and the promise it holds for high-density functional integration and heterogeneous integration. Technical leaders from around the world come together in this volume, the 18th in a popular series from the Materials Research Society, to offers a comprehensive overview of the current state of advanced metallization science and technologies. Topics include: advanced interconnects, 3D integration and packaging; CMP; reliability, test and characterization; metallization; integration; low-k/dielectric materials and characterization; atomic layer deposition (ALD) and barriers.
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×Product details
- Date Published: January 2003
- format: Hardback
- isbn: 9781558997196
- length: 882 pages
- dimensions: 235 x 160 x 50 mm
- weight: 1.35kg
- availability: Temporarily unavailable - available from TBC
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