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Thin Film Materials
Stress, Defect Formation and Surface Evolution

Authors:
L. B. Freund, Brown University, Rhode Island
S. Suresh, Massachusetts Institute of Technology

Date Published: March 2004
availability: Available
format: Hardback
isbn: 9780521822817

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Thin film mechanical behavior and stress presents a technological challenge for materials scientists, physicists and engineers. This book provides a comprehensive coverage of the major issues and topics dealing with stress, defect formation, surface evolution and allied effects in thin film materials. Physical phenomena are examined from the continuum down to the sub-microscopic length scales, with the connections between the structure of the material and its behavior described. Theoretical concepts are underpinned by discussions on experimental methodology and observations. Fundamental scientific concepts are embedded through sample calculations, a broad range of case studies with practical applications, thorough referencing, and end of chapter problems. With solutions to problems available on-line, this book will be essential for graduate courses on thin films and the classic reference for researchers in the field.
- Comprehensive treatment of all issues relevant to stress in thin films
- Balanced coverage of theory, experiment and simulation
- Ideal for teaching, contains illustrative examples, case studies and exercises
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Reviews & endorsements
'The book is a landmark in a rich subject which has seen many developments over the past decade. In addition to being beautifully written, the book contains many illustrations, micrographs, and problems for students. The book will serve as a graduate text, as well as a comprehensive monograph everyone working in the field will want to own.' Professor John W. Hutchinson, Harvard University
'Freund and Suresh have written a masterpiece on thin film materials that will become a classic reference for this newly developed field. Their book provides an organized and beautifully written exposition of the subject of thin film mechanical behavior. For the first time there is a single starting point for the field. The book brings together materials and mechanics aspects of thin films effortlessly, reflecting the authors' expertise in joining these fields of science and engineering.' Professor William D. Nix, Stanford University
'I would heartily recommend this book as an essential read for anyone working in any area of thin film deposition.' Materials World
'Thin Film Materials will prove a valuable resource. It contains a wealth of useful references and good indexes. It is richly illustrated, and there are good exercises after each chapter. For a graduate course in the field, it will be hard to beat. And if the authors are right, there will be a growing demand for such courses.' The Times Higher Education Supplement
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Product details
- Date Published: March 2004
- format: Hardback
- isbn: 9780521822817
- length: 770 pages
- dimensions: 255 x 180 x 43 mm
- weight: 1.65kg
- contains: 75 b/w illus. 75 exercises
- availability: Available
Table of Contents
1. Introduction and overview
2. Film stress and substrate curvature
3. Stress in anisotropic and patterned films
4. Delamination and fracture
5. Film buckling, bulging and peeling
6. Dislocation formation in epitaxial systems
7. Dislocation interactions and strain relaxation
8. Equilibrium and stability of surfaces
9. The role of stress in mass transport.
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Authors
L. B. Freund, Brown University, Rhode Island
L. Ben Freund is the Henry Ledyard Goddard University Professor in the Division of Engineering at Brown University.
S. Suresh, Massachusetts Institute of Technology
Subra Suresh is the Ford Professor of Engineering and Head of the Department of Materials Science and Engineering, and Professor of Mechanical Engineering at Massachusetts Institute of Technology.