Materials, Technology and Reliability for Advanced Interconnects and Low-K Dielectrics — 2004
£25.99
Part of MRS Proceedings
- Editors:
- R. J. Carter, LSI Logic Corporation, Oregon, USA
- C. S. Hau-Riege, Advanced Micro Devices Inc, California
- G. m. Kloster, Intel Corporation, Oregon, USA
- T. -M. Lu, Rensselaer Polytechnic Institute, New York
- S. E. Schulz, TU Chemnitz, Germany
- Reprinted: June 2014
- Date Originally Published: September 2004
- availability: Available
- format: Paperback
- isbn: 9781107409224
£
25.99
Paperback
Other available formats:
Hardback
Looking for an inspection copy?
This title is not currently available on inspection
-
The scaling of device dimensions with a simultaneous increase in functional density has imposed tremendous challenges for materials, technology, integration and reliability of interconnects. To meet requirements of the ITRS roadmap, new materials are being introduced at a faster pace in all functions of multilevel interconnects. The issues addressed in this book cannot be dispelled as simply selecting a low-k material and integrating it into a copper damascene process. The intricacies of the back end for sub-100nm technology include novel processing of low-k materials, employing pore-sealing techniques and capping layers, introducing advanced dielectric and diffusion barriers, and developing novel integration schemes. This is in addition to concerns of performance, yield, and reliability appropriate to nanoscaled interconnects. Although many challenges continue to impede progress along the ITRS roadmap, the contributions in this book confront them head-on. It provides a scientific understanding of the issues and stimulate new approaches to advanced multilevel interconnects.
Customer reviews
Not yet reviewed
Be the first to review
Review was not posted due to profanity
×Product details
- Reprinted: June 2014
- Date Originally Published: September 2004
- format: Paperback
- isbn: 9781107409224
- length: 422 pages
- dimensions: 229 x 152 x 22 mm
- weight: 0.56kg
- availability: Available
Sorry, this resource is locked
Please register or sign in to request access. If you are having problems accessing these resources please email [email protected]
Register Sign in» Proceed
You are now leaving the Cambridge University Press website. Your eBook purchase and download will be completed by our partner www.ebooks.com. Please see the permission section of the www.ebooks.com catalogue page for details of the print & copy limits on our eBooks.
Continue ×Are you sure you want to delete your account?
This cannot be undone.
Thank you for your feedback which will help us improve our service.
If you requested a response, we will make sure to get back to you shortly.
×