Advanced Metallization Conference 2005 (AMC 2005)
Volume 21
£23.99
Part of MRS Conference Proceedings
- Editors:
- Sywert H. Brongersma, IMEC, Leuven
- Thomas C. Taylor, Rohm and Haas Electronic Materials, Marlborough
- Manabu Tsujimura, Ebara Corporation, Fujisawa-shi
- Kazuya Masu, Tokyo Institute of Technology
- Date Published: January 2006
- availability: Available
- format: Hardback
- isbn: 9781558998650
£
23.99
Hardback
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Technical leaders from around the world gather here to discuss developments in the areas of interconnect performance, advanced metallization, low-dielectric constant materials, barrier metallization, atomic layer deposition, advanced packaging and vertical integration. Both current state-of-the-art and ongoing challenges associated with multilevel interconnect are addressed. Included are papers on the latest developments in the integration of low-dielectric constant materials with copper-based metallization, and advances in the understanding of means by which process- or stress-induced damage can be mitigated and reliability of the interconnect system improved. Additional contributions discuss the design, development and modeling of advanced on-chip and multichip interconnect architectures and real-world implementation of optimized designs, materials and processes for production of leading-edge microelectronic devices.
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×Product details
- Date Published: January 2006
- format: Hardback
- isbn: 9781558998650
- length: 782 pages
- dimensions: 235 x 160 x 44 mm
- weight: 1.16kg
- availability: Available
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