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Look Inside Thin Films: Stresses and Mechanical Properties IX

Thin Films: Stresses and Mechanical Properties IX

Volume 695

Out of Print

Part of MRS Proceedings

  • Reprinted: June 2014
  • Date Originally Published: April 2002
  • availability: Unavailable - out of print
  • format: Paperback
  • isbn: 9781107412064

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  • This book, the ninth in a popular series from the Materials Research Society, is strengthened by invited and contributed papers covering a wide range of subjects, from processing-microstructure-mechanical property relationships, strain effects and self-organization in thin films, nanoscale defects and thermomechanical behavior of materials, to novel nanscale materials testing. While the collection continues the series theme of materials science related modeling and characterization of mechanical properties of materials, special focus is given to: strain relaxation and strengthening mechanisms; defects formation; mechanical properties and nanoscale testing; adhesion and fracture; thin-film applications in MEMS; computational modeling and experiments; and film deposition, microstructure, evolution and intrinsic stress.

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    Product details

    • Reprinted: June 2014
    • Date Originally Published: April 2002
    • format: Paperback
    • isbn: 9781107412064
    • length: 532 pages
    • dimensions: 229 x 152 x 27 mm
    • weight: 0.71kg
    • availability: Unavailable - out of print
  • Editors

    Cengiz S. Ozkan, University of California, Riverside

    L. Ben Freund, Brown University, Rhode Island

    Robert C. Cammarata, The Johns Hopkins University

    Huajian Gao, Max-Planck-Institut für Metallforschung, Germany

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