Advanced Metallization Conference 2006 (AMC 2006)
Volume 22
Part of MRS Conference Proceedings
- Editors:
- Stephen W. Russell, Micron Technology, Boise, Idaho
- Michael E. Mills, Dow Chemical - Advanced Electronic Materials, Midland, Michigan
- Akihiko Osaki, Renesas Technology Corporation, Hyogo
- Takashi Yoda, Toshiba Corporation, Yokohama
- Date Published: February 2007
- availability: Available
- format: Hardback
- isbn: 9781558999473
Hardback
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The Advanced Metallization Conference 2006 - held in Tokyo and San Diego, California - highlights both current state-of-the-art and ongoing challenges associated with multilevel interconnects. Technical leaders from around the world gathered to discuss developments in the integration of low-dielectric constant materials with copper-based metallization, and advances in the means by which process- or stress-induced damage can be mitigated and reliability of the interconnect system improved. Contributions to the volume focus on design, development and modeling of advanced on-chip and multichip interconnect architectures and real-world implementation of optimized designs, materials and processes for production of leading-edge microelectronic devices. A keynote address by H.-S. Philip Wong, Stanford University, on 'Nanostructured Materials for Interconnects' is featured.
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×Product details
- Date Published: February 2007
- format: Hardback
- isbn: 9781558999473
- dimensions: 235 x 158 x 41 mm
- weight: 1.07kg
- availability: Available
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