Advanced Metallization Conference 2001 (AMC 2001)
Volume 17
£23.99
Part of MRS Conference Proceedings
- Editors:
- Andrew J. McKerrow, Texas Instruments, Inc., Dallas
- Yosi Sacham-Diamand, Tel-Aviv University
- Shigeaki Zaima, Nagoya University, Japan
- Takayuki Ohba, Fujitsu Limited, Tokyo
- Date Published: January 2002
- availability: Temporarily unavailable - available from November 2023
- format: Hardback
- isbn: 9781558996700
£
23.99
Hardback
Looking for an inspection copy?
This title is not currently available on inspection
-
Leading-edge advanced metallization schemes, as applied to VLSI interconnects, include the introduction of novel metals systems and novel dielectric materials. Technological advances highlighted at AMC 2001 include the latest developments in integrating copper metallization with low-dielectric constant materials, and evaluations of the reliability of such interconnects. Recently, in both industry and academia there has been increased interest in basic research as applied to the field of vertical integration. Since the problems that affect vertical integration are similar to those of VLSI interconnects, it is natural to include the topic here. In fact, it is anticipated that cross fertilization between the fields of VLSI metallization and vertical interconnect will yield a viable technical solution to the problem of multichip integration. This book offers a comprehensive look at the current state of the art of VLSI interconnects. Topics include: process integration; vertical integration and advanced packaging; copper metallization; low-K dielectrics technology; modeling; reliability; barriers; atomic-layer epitaxy and other technologies; and CMP and automation.
Customer reviews
Not yet reviewed
Be the first to review
Review was not posted due to profanity
×Product details
- Date Published: January 2002
- format: Hardback
- isbn: 9781558996700
- length: 719 pages
- dimensions: 235 x 159 x 42 mm
- weight: 1.11kg
- availability: Temporarily unavailable - available from November 2023
Sorry, this resource is locked
Please register or sign in to request access. If you are having problems accessing these resources please email [email protected]
Register Sign in» Proceed
You are now leaving the Cambridge University Press website. Your eBook purchase and download will be completed by our partner www.ebooks.com. Please see the permission section of the www.ebooks.com catalogue page for details of the print & copy limits on our eBooks.
Continue ×Are you sure you want to delete your account?
This cannot be undone.
Thank you for your feedback which will help us improve our service.
If you requested a response, we will make sure to get back to you shortly.
×