Thin Films – Stresses and Mechanical Properties VIII
Volume 594
Part of MRS Proceedings
- Editors:
- Richard Vinci, Lehigh University, Pennsylvania
- Oliver Kraft, Max-Planck-Institut für Metallforschung, Germany
- Neville Moody, Sandia National Laboratories, California
- Paul Besser, AMD-Motorola Alliance Logic Technology, U.S.A.
- Edward Shaffer, II, Dow Chemical Company, Michigan
- Date Published: September 2000
- availability: Unavailable - out of print
- format: Hardback
- isbn: 9781558995024
Hardback
Other available formats:
Paperback
Looking for an inspection copy?
This title is not currently available on inspection
-
An understanding of mechanical behavior is crucial for a wide variety of thin-film technologies such as semiconductor devices and packaging (including advanced interconnects, dielectrics and silicides), information storage media, hard coatings, microelectromechanical systems (MEMS), and biomedical devices. The influence of mechanical behavior is seen in thin-film performance and reliability, as well as morphology development during processing and service. The increased need for understanding of these properties has challenged modern materials science because concepts, models and techniques developed for bulk materials often do not apply in small dimensions. This book addresses key issues in the still growing field of thin-film mechanical behavior. Topics include: multilayer thin films; metallic thin films; epitaxy, deposition parameters, microstructure and stresses; thin films for applications in MEMS; polymer thin films; mechanical properties of amorphous and crystalline carbon; adhesion and fracture; reliability in microelectronics; and nanoindentation and advanced testing techniques.
Customer reviews
Not yet reviewed
Be the first to review
Review was not posted due to profanity
×Product details
- Date Published: September 2000
- format: Hardback
- isbn: 9781558995024
- length: 568 pages
- dimensions: 229 x 152 x 32 mm
- weight: 0.92kg
- availability: Unavailable - out of print
Sorry, this resource is locked
Please register or sign in to request access. If you are having problems accessing these resources please email [email protected]
Register Sign in» Proceed
You are now leaving the Cambridge University Press website. Your eBook purchase and download will be completed by our partner www.ebooks.com. Please see the permission section of the www.ebooks.com catalogue page for details of the print & copy limits on our eBooks.
Continue ×Are you sure you want to delete your account?
This cannot be undone.
Thank you for your feedback which will help us improve our service.
If you requested a response, we will make sure to get back to you shortly.
×