Advanced Metallization Conference 2008 (AMC 2008)
Volume 24
Part of MRS Conference Proceedings
- Editors:
- Mehul Naik, Applied Materials Inc., Santa Clara
- Roey Shaviv, Novellus Systems, Inc., San Jose
- Takashi Yoda, Toshiba Corporation, Yokohama
- Kazuyoshi Ueno, Shibaura Injstitute of Technology, Tokyo
- Date Published: January 2009
- availability: Out of stock in print form with no current plan to reprint
- format: Hardback
- isbn: 9781605111254
Hardback
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The Advanced Metallization Conference - held in San Diego, California, and Tokyo, Japan - marked its 25th anniversary in 2008. These two sister conferences form a unique 'one conference at two sites' that focuses on the latest R&D and manufacturing results, as well as real-world integration and reliability data on the application of metallization and related technologies for advanced IC devices. Scientists and engineers from around the world came to listen and present state-of-the-art work in the field of ULSI interconnect technology including metallization, dielectrics, integration, packaging, design and vertical integration. A keynote address by Gary Patton, vice president, IBM Systems and Technology Group, on 'Leading-edge Silicon Technology through Innovation and Collaboration', is featured. Additional topics include: integration; metallization; materials and characterization; CMP and cleaning; 3D integration and packaging; low-k materials; and reliability and yield.
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×Product details
- Date Published: January 2009
- format: Hardback
- isbn: 9781605111254
- length: 769 pages
- dimensions: 235 x 158 x 43 mm
- weight: 1.15kg
- availability: Out of stock in print form with no current plan to reprint
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