Materials Reliability Issues in Microelectronics
Volume 225
$39.99 (C)
Part of MRS Proceedings
- Editors:
- James R. Lloyd, Digital Equipment Corporation, Hudson, Massachusetts
- Frederick G. Yost, Sandia National Laboratories, Albuquerque, New Mexico
- Paul S. Ho, IBM T J Watson Research Center, New York
- Date Published: October 1991
- availability: Out of stock in print form with no current plan to reprint
- format: Hardback
- isbn: 9781558991194
$
39.99
(C)
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With the increased complexity of modern integrated circuits, it is important that reliability problems be attacked properly with the appropriate tools. This volume recognizes that almost all reliability problems are materials problems, and helps to put 'reliabilty physics' on a firm scientific foundation. Topics include: electromigration; stress effects on reliability; stress and packaging; metallization; device, oxide and dielectric reliability; new investigative techniques; corrosion.
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×Product details
- Date Published: October 1991
- format: Hardback
- isbn: 9781558991194
- length: 382 pages
- dimensions: 235 x 155 x 25 mm
- weight: 0.7kg
- availability: Out of stock in print form with no current plan to reprint
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