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Look Inside Ion Beams and Nano-Engineering

Ion Beams and Nano-Engineering

Volume 1181

$34.99 (C)

Part of MRS Proceedings

  • Reprinted: June 2014
  • Date Originally Published: March 2010
  • availability: Available
  • format: Paperback
  • isbn: 9781107408234

$ 34.99 (C)
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About the Authors
  • Ion beam techniques provide unique capabilities for exploring and custom-tailoring properties, structure, interactions, and configuration of polymeric materials, biomolecular materials and biocompatible materials. New understanding of ion beam-matter interactions, and new facilities for precision ion beam processing now enable applications ranging from nanofabrication, nanopatterning and high-resolution resist lithography, and nanoparticle self assembly, to selective activation of surfaces, manipulation of cells, fabrication of biocompatible materials and fabrication of structures for 3D chip interaction. Presentations included in this volume address both the science and the emerging techniques underlying the fast-growing array of ion beam applications in which nanoscale dimensions or features are of critical significance. Topics include: beam lithography, pattern formation and nanowires; magnetic , optical and semiconductor applications; nanostructure formation and fabrication of 3D structures; ion-solid interactions; and biological and biomedical applications.

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    Product details

    • Reprinted: June 2014
    • Date Originally Published: March 2010
    • format: Paperback
    • isbn: 9781107408234
    • length: 188 pages
    • dimensions: 229 x 152 x 10 mm
    • weight: 0.26kg
    • availability: Available
  • Table of Contents

    Part I. Beam Lithography, Pattern Formation and Nanowires
    Part II. Magnetic, Optical and Semiconductor Applications
    Part III. Nanostructure Formation and Fabrication of 3D Structures
    Part IV. Ion-solid Interactions
    Part V. Biological and Biomedical Applications
    Author index
    Subject index.

  • Editors

    Daryush Ila, Alabama A&M Univesity

    Paul K. Chu, City University of Hong Kong

    Jörg K. N. Lindner, Universität-Gesamthochschule Paderborn, Germany

    Naoki Kishimoto, National Institute of Materials Science, Japan

    John E. E. Baglin, IBM Almaden Research Center, California

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