Electronic Packaging Materials Science IX
Volume 445
AUD$39.95 exc GST
Part of MRS Proceedings
- Editors:
- Steven K. Groothuis, Texas Instruments, Inc. Dallas
- Paul S. Ho, University of Texas, Austin
- Kenzo Ishida, Intel Corporation Tsukuba, Ibaraki
- Tien Wu, IBM Microelectronics Endicott, New York
- Date Published: October 1997
- availability: Out of stock in print form with no current plan to reprint
- format: Hardback
- isbn: 9781558993495
AUD$
39.95
exc GST
Hardback
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While this book continues the spirit of the MRS series on materials science related to the development of electronic packaging, it also focuses on three very specific technological areas - technology for flip-chip packaging, materials metrology and characterization, and packaging reliability and testing. These are important areas for technology development in electronic packaging, particularly since materials and processing play an important role in controlling system performance and reliability. Topics include: flip-chip and solder technology; future packaging technology; manufacturing technology in packaging; packaging materials and metrology; interfacial adhesion and fracture and packaging reliability and testing.
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×Product details
- Date Published: October 1997
- format: Hardback
- isbn: 9781558993495
- length: 322 pages
- dimensions: 240 x 160 mm
- weight: 0.614kg
- availability: Out of stock in print form with no current plan to reprint
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